MicroLED IDM Mass<br> Production Platform Built on <br>Large-Size GaN-on-Si and <br>Hybrid Bonding MicroLED IDM Mass<br> Production Platform Built on <br>Large-Size GaN-on-Si and <br>Hybrid Bonding

MicroLED IDM Mass
Production Platform Built on
Large-Size GaN-on-Si and
Hybrid Bonding

MicroLED IDM Mass
Production Platform Built on
Large-Size GaN-on-Si and
Hybrid Bonding
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GaN-on-Si GaN-on-Si
GaN-on-Si
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Breaking Through Size Barriers Breaking Through Size Barriers Breaking Through Size Barriers
Highly Compatible with<br> Homogeneous Substrates Highly Compatible with
Homogeneous Substrates Highly Compatible with Homogeneous Substrates
World-Class Talent and<br> Equipment Capabilities World-Class Talent and
Equipment Capabilities World-Class Talent and Equipment Capabilities
Optimized for Semiconductor<br> Manufacturing Lines Optimized for Semiconductor
Manufacturing Lines Optimized for Semiconductor Manufacturing Lines
High-Precision Hybrid Bonding and <br>Stacking Technology Platform High-Precision Hybrid Bonding and <br>Stacking Technology Platform
High-Precision Hybrid Bonding and
Stacking Technology Platform
High-Precision Hybrid Bonding and Stacking Technology Platform
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High-Precision Room-Temperature Hybrid Bonding
High-Precision Room-Temperature Hybrid Bonding High-Precision Room-Temperature Hybrid Bonding
Superior Light Extraction Efficiency
Superior Light Extraction Efficiency Superior Light Extraction Efficiency
Enabling Production-Ready Yields for Three-Color Stacked Devices
Enabling Production-Ready Yields for Three-Color Stacked Devices Enabling Production-Ready Yields for Three-Color Stacked Devices
A Novel Approach to Compound Semiconductor Heterogeneous Integration
A Novel Approach to Compound Semiconductor Heterogeneous Integration A Novel Approach to Compound Semiconductor Heterogeneous Integration
End-to-End IDM End-to-End IDM
End-to-End IDM
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Equipment
Full-Stack Equipment Capabilities for Integrated Manufacturing from Epitaxy to Packaging and Testing.
Full-Stack Equipment Capabilities for Integrated Manufacturing from Epitaxy to Packaging and Testing.
Design Technology
Integrated Design Capabilities Spanning LED, Optics, Drivers, and More.
Integrated Design Capabilities Spanning LED, Optics, Drivers, and More.
Industry Expertise
A Team of Advanced Semiconductor Manufacturing Experts, Supported by Industry Advisors from China and Around the World.
A Team of Advanced Semiconductor Manufacturing Experts, Supported by Industry Advisors from China and Around the World.
Full-Color Technology Roadmap
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Dual-Red Technology Roadmap

Ternary Red: · Large-Size Substrates · Si Compatibility · Platform Scalability

Quaternary Red: · High-Purity Red · Mature Processes · Stable Adoption.

Dual-Red Technology Roadmap

Ternary Red: · Large-Size Substrates · Si Compatibility · Platform Scalability

Quaternary Red: · High-Purity Red · Mature Processes · Stable Adoption.

Dual-Red Technology Roadmap
Two Full-Color Product Solutions

We are advancing two complementary technologies "X-Cube Beam Combining" and "Monolithic/Stacked Full-Color Integration" to deliver versatile, high-performance microdisplay solutions for near-eye applications.

Two Full-Color Product Solutions

We are advancing two complementary technologies "X-Cube Beam Combining" and "Monolithic/Stacked Full-Color Integration" to deliver versatile, high-performance microdisplay solutions for near-eye applications.

Two Full-Color Product Solutions
Full-Color Technology Roadmap
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Dual-Red Technology Roadmap

Ternary Red: · Large-Size Substrates · Si Compatibility · Platform Scalability

Quaternary Red: · High-Purity Red · Mature Processes · Stable Adoption.

Two Full-Color Product Solutions

We are advancing two complementary technologies "X-Cube Beam Combining" and "Monolithic/Stacked Full-Color Integration" to deliver versatile, high-performance microdisplay solutions for near-eye applications.

Dual-Red Technology Roadmap
Two Full-Color Product Solutions