MicroLED Manufacturing Production<br>Ready MicroLED MicroLED Manufacturing Production<br>Ready MicroLED

MicroLED Manufacturing Production
Ready MicroLED
with Semiconductor Processes

MicroLED Manufacturing Production
Ready MicroLED
with Semiconductor Processes
Large-Scale Manufacturing Capability Large-Scale Manufacturing Capability
Large-Scale Manufacturing Capability
Equipment: Key Manufacturing Platforms for Epitaxy, Etching, and Hybrid Bonding
Equipment: Key Manufacturing Platforms for Epitaxy, Etching, and Hybrid Bonding
Hybrid Bonding
Wafer-Level High-Precision Bonding and Heterogeneous Integration.
ICP Etching
High-Precision Plasma Etching and Patterning.
Epitaxy Platform
8-Inch GaN-on-Si Epitaxy Capability.
End-to-End Manufacturing from
Epitaxy to Packaging & Testing
End-to-End Manufacturing from
Epitaxy to Packaging & Testing
End-to-End Design and Manufacturing Capabilities
End-to-End Design and Manufacturing Capabilities
End-to-End Manufacturing from <br>Epitaxy to Packaging & Testing End-to-End Manufacturing from <br>Epitaxy to Packaging & Testing
Proven Manufacturing Expertise Proven Manufacturing Expertise
Proven Manufacturing Expertise
Customer Qualification & Production Ramp-Up
Backed by extensive 8-inch GaN-on-Si IDM manufacturing experience, we support customers from product qualification and production ramp-up through high-volume manufacturing.
8-Inch InGaN
Pilot Production Line
8-Inch AlInGaP
Pilot Production Line
8-/12-Inch Mass
Production Lines
Facilities Under Construction
Workforce Composition
Global Industry Experts Collaborating Across Process, Design, Packaging & Testing, Modules, and Customer Ramp-Up.
65
%
Technical Staff
Technical Staff
75
%
From Large-Scale IC Manufacturing Platforms
From Large-Scale IC Manufacturing Platforms