Continued Growth in Bandwidth Demand
AI computing systems require rapidly increasing interconnect bandwidth. Meanwhile, achieving higher data rates per channel is becoming more complex, power-intensive, and costly.
Growing Challenges for Electrical Interconnects
As data rates increase, electrical interconnects face greater challenges related to power consumption, crosstalk, equalization, insertion loss, and overall signal integrity.
Increasing Interconnect Density
Chip-to-chip, board-to-board, and intra-rack connections require increasingly dense interconnect architectures that deliver higher bandwidth within limited space and power budgets.
Direct electrical-to-optical conversion with efficient fiber coupling—enabled by microLED technology.
Exceptional Energy Efficiency
20× Lower Power
Consumption
Consumption
Higher Aggregate Bandwidth
Wide-and-Slow Parallel
Transmission Architecture
Transmission Architecture
Reliable Performance in Extreme Environments
Robust, High-Density
Interconnects
Interconnects
High-Bandwidth MicroLED
3 GHz Modulation Bandwidth, Exceptional Energy Efficiency.